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tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 1 16797 1 2 3 4 ir receiver modules for remote control systems description the tsop69.. - series are miniaturized receivers for infrared remote control systems. pin diode and preamplifier are assembled on lead frame, the epoxy package is designed as ir filter. the demodulated output signal can directly be decoded by a microprocessor. the main benefit is the operation with a high envelope duty cycle datasignal and the good immunity against disturbance signals with spike characteristic as well as all continuous dis- turbance signals. features ? photo detector and preamplifier in one package internal filter for pcm frequency improved shielding against electrical field disturbance ttl and cmos compatibility output active low low power consumption high immunity against ambient light special features enhanced data rate of 4000 bit/s operation with short bursts possible ( 6 cycles/burst) taping available for topview and sideview assem- bly. mechanical data pinning: 1 = gnd, 2 = gnd, 3 = v s , 4 = out parts table block diagram application circuit part carrier frequency tsop6930 30 khz tsop6933 33 khz tsop6936 36 khz TSOP6937 36.7 khz tsop6938 38 khz tsop6940 40 khz tsop6956 56 khz 25 k ? 3 1;2 v s out demo- gnd pass agc input pin band dulator control circuit 4 c 1 = 4.7 f tsopxxxx out gnd circuit c r 1 =100 ? +v s gnd transmitter with tsalxxxx v s r 1 +c 1 recommended to suppress power supply disturbances. v o the output voltage should not be hold continuously at a voltage below v o = 3.3 v by the external circuit. 16842 e3
www.vishay.com 2 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors absolute maximum ratings absolute maximum ratings t amb = 25 c, unless otherwise specified electrical and opti cal characteristics t amb = 25 c, unless otherwise specified parameter test condition symbol value unit supply voltage pin 3 v s - 0.3 to 6.0 v supply current pin 3 i s 5ma output voltage pin 4 v o - 0.3 to 6.0 v output current pin 4 i o 15 ma junction temperature t j 100 c storage temperature range t stg - 40 to + 100 c operating temperature range t amb - 25 to + 85 c power consumption t amb 85 c p tot 50 mw parameter test condition symbol min ty p. max unit supply current v s = 5 v, e v = 0 i sd 0.8 1.2 1.5 ma v s = 5 v, e v = 40 klx, sunlight i sh 1.5 ma supply voltage v s 4.5 5.5 v transmission distance e v = 0, test signal see fig.1, ir diode tsal6200, i f = 400 ma d35m output voltage low (pin 4) i osl = 0.5 ma, e e = 0.7 mw/m 2 , test signal see fig. 1 v osl 250 mv minimum irradiance (30 - 40 khz) pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o , test signal see fig.3 e e min 0.35 0.5 mw/m 2 minimum irradiance (56 khz) pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o , test signal see fig.3 e e min 0.4 0.6 mw/m 2 maximum irradiance t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e max 30 w/m 2 directivity angle of half transmission distance ? 1/2 50 deg
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 3 typical characteris tics (tamb = 25 c unless otherwise specified) figure 1. output function figure 2. pulse length and sens itivity in dark ambient figure 3. output function e e t t pi *) t v o v oh v ol t po 2) t 14337 optical test signal (ir diode tsal6200, i f =0.4 a, n=6 pulses, f=f 0 , t=10 ms) output signal t d 1) 1) 3/f 0 < t d < 9/f 0 2) t pi C 4/f 0 < t po < t pi + 6/f 0 *) t pi 6/fo is recommended for optimal function t C output pulse width ( ms ) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.1 1.0 10.0 100.0 1000.010000.0 e e C irradiance ( mw/m 2 ) 16907 po input burst duration = 950 nm, optical test signal, fig.1 output pulse e e t v o v oh v ol t 600 s 600 s t = 60 ms t on t off 94 8134 optical t est signal output signal , ( see fig.4 ) figure 4. output pulse diagram figure 5. frequency dependence of responsivity figure 6. sensitivity in bright ambient t ,t C output pulse width ( ms ) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.1 1.0 10.0 100.0 1000.010000.0 e e C irradiance ( mw/m 2 ) 16910 to ff = 950 nm, optical test signal, fig.3 to n on off 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.7 0.9 1.1 1.3 f/f 0 C relative frequency 16926 f = f 0 5% f ( 3db ) = f 0 /7 e / e C rel. responsivity e min e 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.01 0.10 1.00 10.00 100.00 e C ambient dc irradiance (w/m 2 ) 16911 correlation with ambient light sources: 10w/m 2 1.4klx (std.illum.a,t=2855k) 10w/m 2 8.2klx (daylight,t=5900k) ambient, = 950 nm e C threshold irradiance ( mw/m ) e min 2
www.vishay.com 4 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors figure 7. sensitivity vs. supply voltage disturbances figure 8. sensitivity vs. el ectric field disturbances figure 9. max. envelope duty cycle vs. burstlength 0.0 0.5 1.0 1.5 2.0 0.1 1.0 10.0 100.0 1000.0 v srms C ac voltage on dc supply voltage (mv) 16912 f = f o f = 10 khz e C threshold irradiance ( mw/m ) e min 2 f = 1 khz f = 100 hz e C threshold irradiance ( mw/m ) 0.0 0.4 0.8 1.2 1.6 0.0 0.4 0.8 1.2 2.0 e C field strength of disturbance ( kv/m ) 2.0 94 8147 1.6 e min 2 f(e) = f 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 20 40 60 80 100 120 140 160 180 200 burst length ( number of cycles / burst ) 18658 f = 38 khz, e e = 2 mw/m 2 max. envelope duty cycle figure 10. sensitivity vs. ambient temperature figure 11. relative spectral sensitivity vs. wavelength figure 12. directivity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 C30C150 153045607590 t amb C ambient temperature ( q c ) 16918 sensitivity in dark ambient e C threshold irradiance ( mw/m ) e min 2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 750 850 950 1050 1150 - wavelength ( nm ) 16919 s( ) - relative spectral sensitivity rel 16801 0.4 0.2 0 0.2 0.4 0.6 0.6 0.9 0 30 10 20 40 50 60 70 80 1.0 0.8 0.7 d rel - relative transmission distance
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 5 suitable data format the circuit of the tsop69.. is designed in that way that unexpected output pulses due to noise or distur- bance signals are avoided. a bandpass filter, a limiter stage, an integrator stage and an automatic gain con- trol are used to suppress such disturbances. the distinguishing mark between data signal and dis- turbance signal are carrier frequency, burst length and duty cycle. the data signal s hould fulfill the following conditions: carrier frequency should be close to center fre- quency of the bandpass (e.g. 38 khz). burst length should be 6 cycles/burst or longer. after each burst which is between 6 cycles and 120 cycles a gap time of at least 10 cycles is necessary. for each burst which is longer than 3.2 ms a corre- sponding gap time is necessary at some time in the data stream. this gap time should have at least same length as the burst. up to 2200 short bursts per second can be received continuously. some examples for suitable data format are: nec code, toshiba micom format, sharp code, rc5 code, rc6 code, rcmm code, r-2000 code, recs-80 code. when a disturbance signal is applied to the tsop69.. it can still receive the data signal. however the sensi- tivity is reduced to that level that no unexpected pulses will occur. some examples for such disturbance signals which are suppressed by the tsop69.. are: dc light (e.g. from tungsten bulb or sunlight) continuous signal at 38 khz or at any other fre- quency signals from fluorescent lamps with electronic bal- lasts with various kinds of modulation (see examples in figure 13 and figure 14). figure 13. ir signal from fluores cent lamp with low modulation figure 14. ir signal from a fluorescent lamp with spikes 0 5 10 15 20 time ( ms ) 16920 ir signal ir signal from fluorescent lamp with low modulation time(ms) 18659 ir signal 0 1 2 3 4 5 6 7 8 9 0246810
www.vishay.com 6 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors package dimensions in mm assembly instructions reflow soldering reflow soldering must be done within 72 hours stored under max. 30 c, 60 % rh after opening envelop recommended soldering paste (composition: sn 63 %, pb 37 %) melting temperature 178 c to 192 c apply solder paste to the specified soldering pads, by using a dispenser or by screen printing. 16629
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 7 recommended thickness of metal mask is 0.2 mm for screen printing. the recommended reflow furnace is a combination- type with upper and lower heaters. set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown below. excercise extreme care to keep the maximum temperature below 230 c. the following temperature profile means the tempera ture at the device surface. since temperature differ ence occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. handling after reflow should be done only after the work surface has been cooled off. manual soldering use the 6/4 solder or the solder containing silver. use a soldering iron of 25 w or smaller. adjust the temperature of the soldering iron below 300 c. finish soldering within three seconds. handle products only after the temperature is cooled off. cleaning perform cleaning after sold ering strictly in conform- ance to the follo wing conditions: cleaning agent: 2-propanol (isopropyl alcohol) commercially available grade s (industrial use) should be used. demineralized or distilled wa ter having a resistivity of not less than 500 m ? corresponding to a conductivity of 2 ms/m. temperature and time: 30 seconds under the tem- perature below 50 c or 3 minutes below 30 c. ultrasonic cleaning: below 20 w. reflow solder profile 10 s max. @ 230 q c 90 s max 0 20 40 60 80 100 120 140 160 180 200 220 240 0 50 100 150 200 250 300 350 time ( s ) temperature ( c ) 16944 q 2 q c - 4 q c/s 120 s - 180 s 2 q c - 4 q c/s
www.vishay.com 8 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors taping version tsop..tt 16584
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 9 taping version tsop..tr 16585
www.vishay.com 10 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors reel dimensions 16734
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 11 leader and trailer cover tape peel strength according to din en 60286-3 0.1 to 1.3 n 300 10 mm/min 165 - 180 peel angle label standard bar code labels for finished goods the standard bar code labels are product labels and used for identification of goods. the finished goods are packed in final packing area. the standard pack- ing units are labeled with standard bar code labels before transported as finished goods to warehouses. the labels are on each packing unit and contain vishay semiconductor gmbh specific data. tr ailer leader no devices no devices min. 200 min. 400 start end devices 96 11818
www.vishay.com 12 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transpor- tation and storage. final packing the sealed reel is packed into a cardboard box. a secondary cardboard box is used for shipping pur- poses. item - description item - number selection - code lot - / serial - number data - code plant - code quantity accepted by: packed by: mixed code indicator origin ino C batch sel cod ptc qty acc pck mixed code xxxxxxx + 18 8 3 10 3 (yww) 2 8 C C C company logo plain writing abbreviation length item - number sequence - number plant - code quantity total length n8 2 3 8 21 long bar code top type length n x n C selectionCcode batch - number data - code filter total length x3 3 10 1 17 short bar code bottom type length n x C C 16942 vishay semiconductor gmbh standard bar code product label (finished goods) aluminium bag label reel 15973
vishay tsop69.. document number 84687 rev. 1.0, 01-mar-05 vishay semiconductors www.vishay.com 13 recommended method of storage dry box storage is recommended as soon as the alu- minium bag has been opened to prevent moisture absorption. the following conditions should be observed, if dry boxes are not available: storage temperature 10 c to 30 c storage humidity 60 % rh max. after more than 72 hours under these conditions moisture content will be too high for reflow soldering. in case of moisture ab sorption, the devices will recover to the former condition by drying under the following condition: 192 hours at 40 c + 5 c/ -0 c and < 5 % rh (dry air/ nitrogen) or 96 hours at 60 c +5 c and < 5 % rh for all device containers or 24 hours at 125 c +5 c not suitable for reel or tubes. an eia jedec standard jesd22-a112 level 4 label is included on all dry bags. example of jesd22-a112 level 4 label esd precaution proper storage and handling procedures should be followed to prevent esd damage to the devices espe- cially when they are removed from the antistatic shielding bag. electro-stat ic sensitive devices warn- ing labels are on the packaging. vishay semiconductors standard bar-code labels the vishay semiconductors standard bar-code labels are printed at final packing areas. the labels are on each packing unit and contain vishay telefunken specific data. 16943 1 6 9 6 2
www.vishay.com 14 document number 84687 rev. 1.0, 01-mar-05 tsop69.. vishay semiconductors ozone depleting substances policy statement it is the policy of vishay semiconductor gmbh to 1. meet all present and future national and international statutory requirements. 2. regularly and continuously improve the performan ce of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. it is particular concern to control or eliminate rele ases of those substances in to the atmosphere which are known as ozone depleting substances (odss). the montreal protocol (1987) and its london amendments (1990) intend to severely restrict the use of odss and forbid their use within the next ten years. various national and international initiatives are pressing for an earlier ban on these substances. vishay semiconductor gmbh has been able to use its po licy of continuous improvements to eliminate the use of odss listed in the following documents. 1. annex a, b and list of transitional substances of the montreal protocol and the london amendments respectively 2. class i and ii ozone depleting substances in the clean air act amendments of 1990 by the environmental protection agency (epa) in the usa 3. council decision 88/540/eec and 91/690/eec annex a, b and c (transitional substances) respectively. vishay semiconductor gmbh can certify that our semi conductors are not manufactured with ozone depleting substances and do not co ntain such substances. we reserve the right to make changes to improve technical design and may do so without further notice. parameters can vary in different applications. all operating parameters must be validated for each customer application by the customer. should the buy er use vishay semiconductors products for any unintended or unauthorized application, the buyer sh all indemnify vishay semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. vishay semiconductor gmbh, p.o.b. 3535, d-74025 heilbronn, germany telephone: 49 (0)7131 67 2831, fax number: 49 (0)7131 67 2423
legal disclaimer notice vishay document number: 91000 www.vishay.com revision: 08-apr-05 1 notice specifications of the products displayed herein are subjec t to change without notice. vishay intertechnology, inc., or anyone on its behalf, assume s no responsibility or liability fo r any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in vishay's terms and conditions of sale for such products, vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and /or use of vishay products including liab ility or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyrigh t, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify vishay for any damages resulting from such improper use or sale.

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